MediaTek Dimensity 7200 chipset with 200-megapixel cameras support announced
The MediaTek Dimensity 7200 chipset is based on the TSMC 4nm manufacturing process and includes two Arm Cortex-A715 cores with up to 2.8GHz clock speed and six Cortex-A510 cores with up to 2.0GHz clock speed.
MediaTek, on Thursday, announced its first Dimensity 7000 series chipset, the MediaTek Dimensity 7200. According to the company, the new Dimensity 7200 SoC comes with cutting-edge AI imaging features, powerful gaming optimizations, better 5G speeds, and enhanced efficiency to provide extended battery life.
The MediaTek Dimensity 7200 chipset is based on the TSMC 4nm second-generation manufacturing process. The SoC is an octa-core processor featuring two Arm Cortex-A715 cores with up to 2.8GHz clock speed and six Cortex-A510 cores with up to 2.0GHz clock speed. Further, the chipset’s built-in AI Processing Unit (APU) maximizes the efficiency of AI tasks and AI fusion processing to deliver better performance.
The Dimensity 7200 SoC comes with ARM Mali G610 GPU that can deliver high frame rates with fast response time. For gamers, it also includes MediaTek HyperEngine 5.0 technology that supports AI-based Variable Rate Shading (VRS) for power savings and CPU and GPU Smart resource optimization for better battery life. For display, the MediaTek Dimensity 7200 supports up to full-HD+ resolution display with up to 144Hz refresh rate.
In terms of camera, the MediaTek Dimensity 7200 is equipped with Imagiq 765 and a 14-bit HDR-ISP that supports 200-megapixel main cameras for enhanced photography. It also supports 4K HDR video recording and allows simultaneous capture from two cameras at full-HD resolution. Additionally, the chipset has built-in motion-compensated noise reduction that lets users capture stunning pictures at night or in low-light environments.
Connectivity options include support for tri-band Wi-Fi 6E connectivity, Bluetooth version 5.3, 2CC carrier aggregation, dual 5G SIM, dual VoNR, and standard Sub-6GHz 5G modem with up to 4.7Gbps downlink. It also includes MediaTek’s 5G UltraSave 2.0 technology suite for enhanced cellular power efficiency.
The MediaTek Dimensity 7200 will be available on new 5G devices in the global markets in Q1 2023.
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