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Discussion Apple iPhone 14 Series

Siva

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iPhone 13 release is just around the corner. While we are excited to see the new iPhone series, the next generation iPhone renders are already out. The renders are created by Ian Zelbo.

Here are the Key features of the iPhone 14 based on the renders.

A center punch hole front camera instead of notch, in line with information shared by analyst Ming-Chi Kuo

No rear camera bump, with the lenses, LED flash, and LiDAR Scanner sitting flush with the rear glass. This will be achieved by using a thicker chassis.

A titanium frame

Round volume buttons similar to those on older iPhone 4 and iPhone 5 models

Elongated mesh cutouts for speakers and mic instead of individual holes on the bottom of the device

Lightning connector remains.

hZqqFLv.jpg


Source: Frontpagetech via MacRumors
 

Siva

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iPhone 14 Pro models may have a combination of pill shaped cut out and a punch hole on the front as per the latest rumors. Initially it was expected that the front will only have a punch hole cut out.

zs6Xyqr.jpg


Source: MacRumors via Ross Young
 

Siva

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ProMotion will not be expanded to the entire ‌iPhone 14‌ lineup and will remain exclusive to the Pro models.

Chinese manufacturer BOE would be the supplier of LTPO OLED displays for lower-end ‌iPhone 14‌ models, but he said the company does not have enough production capacity to do so right now.

 

Siva

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Trusted analyst Ming-Chi Kuo has revealed that only the 14 Pro models will get a chip upgrade to A16 bionic this year. The regular models will stay on the A15 bionic chip. The exact reasons for this shift of strategy from Apple is unknown, however, the global chip shortage seems to be the best guess. While A15 is a very potent chip, it doesn't make sense for the iPhone 13 users to upgrade to this year's regular models, if this news proves to be right.

There'll also be a difference in the ram type in Regular vs Pro models. Regular models will come with 6 GB of LPDDR 4X whereas the Pro models will come with the same capacity of LPDDR 5.

 
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