Just few weeks ahead of Samsung
Galaxy S6's launch at the MWC 2014 in
March, Samsung has announced it has
made a breakthrough single-package
solution for memory chips that will use
up to 40 percent less space in
smartphones.
Dubbed ePoP (embedded package on
package) and claimed to be an industry
first, the memory chip packaging fuses
3GB of RAM with 32GB of storage
together along with a controller. The
remaining space inside the smartphones
with the ePoP chips can be used for extr
battery or any other function depending
on what the company plans. The 3GB of
LPDDR3 mobile DRAM gives a I/O
transfer rate of 1866Mbps and comes
with a 64-bit bandwidth.
Samsung further mentioned that these
ePoP chips are already being mass
produced by the firm. The ePoP chip
takes 225 square millimetres of space,
same as a conventional mobile CPU and
is 1.4mm thin so it can be stacked on
top of the CPU inside smartphones.
Samsung said that other OEMs can also
make use of these chips inside their
handsets.
It is worth mentioning that Samsung ha
been offering a similar single-package
solution for wearable devices dubbed
'wearable memory'.
"By offering our new high-density ePoP
memory for flagship smartphones,
Samsung expects to provide its
customers with significant design
benefits, while enabling faster and longe
operation of multi-tasking features," sai
Jeeho Baek, Senior Vice President of
Memory Marketing at Samsung
Electronics during the announcement.
"We plan to expand our line-up of ePoP
memory with packages involving
enhancements in performance and
density over the next few years, to furthe
add to the growth of premium mobile
market."
http://m.gadgets.ndtv.com/mobiles/news/samsung-epop-memory-uses-40-percent-less-space-by-fusing-ram-and-storage-657220
